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Jasper is due this summer and features chippery shrunk from 90nm to 65.
IBM is supplying 65nm Xenon microprocessors for the box. Now, according toCENS,TSMC is to build 65nm graphics chips and north-bridge chips for its latestversion of XBox360 game consoles Advanced Semiconductor Engineering Inc. (ASE)will do the packaging and Nanya PCB Corp. has a hand in the deal too.
The Chinese wire says Microsoft has booked foundry capacity for some 10,000300mm wafers at TSMC.
It also says a further Xbox, with integrated GP and CPU and named Valhalla,is set for autumn 2009.
Quote:
Taipei, May 7, 2008 (CENS)--Microsoft began in April farming outproduction of 65nm graphics chips and north-bridge chips for its latestversion of XBox360 game consoles to Taiwanese foundries TaiwanSemiconductor Manufacturing Co. (TSMC), Advanced SemiconductorEngineering Inc. (ASE) and Nanya PCB Corp.